Thursday, March 14, 2013

Senator John Sherman to Major General William T. Sherman, November 14, 1863

MANSFIELD, OHIO, Nov. 14, 1863.

My Dear Brother:
. . . . . . . . . .

On Tuesday next I start for Gettysburg, to take part in the pageant of a dedication of the battle-field as a national cemetery. From thence I shall probably go to Washington, two weeks in advance of the session. The very first thing I mean to do is to press the enforcement of the draft. The long delay and the various shifts and subterfuges by which the execution of the law has thus far been defeated, is disgraceful, and very injurious to the cause. . . . I notice in some of the Southern papers that a hope is entertained that the draft cannot be enforced. This is idle. The war was never more popular than at this moment. The new call will fall lightly. Ohio must send thirty-five thousand, or one to fifteen of her voters. The apportionment has been made even to townships and wards, and in very many places the quota will be made by voluntary enlistments, aided by large gratuitous bounties from citizens. There is no lack of men or of a determination to send them. The wonderful prosperity of all classes, especially of laborers, has a tendency to secure acquiescence in all measures demanded to carry on the war. We are only another example of a people growing rich in a great war. And this is not shown simply by inflated prices, but by increased production, new manufacturing establishments, new railroads, houses, etc. . . . Indeed, every branch of business is active and hopeful. This is not a mere temporary inflation caused by paper money, but is a steady progress, and almost entirely upon actual capital. The people are prospering and show their readiness to push on the war. Taxes are paid cheerfully, and the voluntary donations for our soldiers and their families are counted by thousands. ... I confide in your success.


SOURCE: Rachel Sherman Thorndike, Editor, The Sherman letters: correspondence between General and Senator Sherman from 1837 to 1891, p. 215-6

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